The NXP MC33662 is a physical layer component dedicated to automotive LIN sub-bus applications.
Participating products are available for a minimum of 10 years. Designated participating products developed for the automotive, telecom and medical segments are available for a minimum of 15 years.
|
|
|
|
|
|
|
|---|---|---|---|---|---|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Quick reference to our documentation types
4 documents
Compact List
Receive the full breakdown. See the product footprint and more in the eCad file.
1-5 of 6 hardware offerings
To get further assistance directly from NXP, please see our Engineering Services.
2 engineering services
To find additional partner offerings that support this product, visit our Partner Marketplace.
